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The science and engineering of microelectronic fabrication /Stephen A. Campbell.
 
Author: Campbell, Stephen A.,
Publisher: New York : Oxford University Press, 1996.
ISBN: 0195105087 (cl acidfree paper)
Format: Books
Physical Description: xv, 536 p. :ill. ;25 cm.
Subjects: Semiconductors Design and construction
 

Table of Contents
   Preface
   Overview and Materials
      Overview of Semiconductor Fabrication
         Introduction
         Layered Technologies: A Simple Example
         Unit Processes
         Technologies Overview
         A Roadmap for the Course
      Semiconductor Substrates
         Phase Diagrams and Solid Solubility
         Crystallography and Crystal Structure
         Crystal Defects
         Czochralski Growth
         Bridgman Growth of GaAs
         Float-Zone Growth
         Wafer Preparation and Specifications
         Summary and Future Trends
   Unit Process I: Hot Processing and Ion Implantation
      Diffusion
         Fick''s Diffusion Equation in One Dimension
         Atomistic Models of Diffusion
         Analytic Solutions of Fick''s Law
         Corrections to the iSimple asdf
         Diffusion Codefficients for Common Dopants
         Analysis of Diffused Profiles
         Diffusion in SiO2
         Diffusion Systems
         SUPREM Simulations of Diffusion Profiles
         Summary
      Thermal Oxidation
         The Deal-Grove Model of Oxidation
         The Linear and Parabolic Rate Coefficients
         The Initial Oxidiation Regime
         The Structure of SiO2
         Oxide Characterization
         The Effects of Dopants on Oxidation and Polysilicon Oxidatation
         Oxidation Induced Stacking Faults
         Alternative Thermal Dielectrics
         Oxidation Systems
         SUPREM III Oxidations
         Summary
      Ion Implantation
         Idealized Ion Implant Systems
         Coulomb Scattering
         Vertical Projection Range
         Channeling and lteral Projected Range
         Implantation Damage
         Shallow Junction Formation
         Buried Dielectrics
         Ion Implant Systems - Problems and Concerns
         Implanted Profiles Using SUPREM III
         Summary
      Rapid Thermal Processing
         Gray Body Radiation, Heat Exchange and Optical Absorption
         High Intensity Optical Sources and the Reflecting Cavity
         Temperature Measurement
         Thermoplastic Stress
         Rapid Thermal Activation of Impurities
         Rapid Thermal Processing of Dielectrics
         Silicidation and Contact Formation
         Advanced Systems
         Summary
   Unit Processes 2: Pattern Transfer
      Optical Exposure Tools
         Lithography Overview
         Diffraction
         The Modulation Transfer Function and Optical Exposures
         Source Systems and Spatial Coherence
         Contact/Proximity Printers
         Projection Printers
         Advanced Mask Concepts
         Surface Reflections and Standing Waves
         Alignment
         Summary
      Photoresists
         Photoresist Types
         Organic Materials and Polymers
         Typical Reactions of DQN Positive Photoresists
         Contrast Curves
         The Critical Modultaion Transfer Function
         Applying and Developing Photoresist
         Second Order Exposure Effects
         Advanced Photoresists and Photoresist Processes
         Summary
      Nonoptical Lithographic Techniques
         Interaction of a High Energy Beam With Matter
         Electron Beam Lithography Systems
         Electron Beam Lithography Summary and Outlook
         X-Ray Sources
         X-Ray Exposure Systems
         X-Ray Masks
         Summary and Outlook for X-Ray Lithography
         E-Beam and X-Ray Resists
         Radiation Damage in MOS Devices
         Summary
      Vacuum Science and Plasmas
         The Kinetic Theory of Gases
         Gas Flow and Conductance
         Pressure Ranges and Vacuum Pumps
         Vacuum Seals and Pressure Measurement
         The DC Glow Discharge
         RF Discharge
         Magnetically Enhanced and ECR Plasmas
         Radiation from Accelerated Charged Particles
         Summary
      Etching
         Wet Etching
         Basic Regimes of Plasma Etching
         High Pressure Plasma Etching
         Ion Milling
         Reactive Ion Etching
         Damage in Reactive Ion Etching
         Magnetically Enhaned Reactive Ion Etch (MERIE) Systems
         Lift Off
         Summary
   Unit Processing 3: Thin Film Deposition and Epitaxial Growth
      Physical Deposition: Evaporation and Sputtering
         Phase Diagrams: Sublimation and Evaporation
         Deposition Rates
         Step Coverage
         Evaporator Systems: Crucible Heating Techniques
         Multicomponent Films
         An Introduction to Sputtering
         Physics of Sputtering
         Deposition Rate



Reviews

Choice
Copyright American Library Association, used with permission.

Campbell overviews the entire field of microfabrication for undergraduate seniors and first-year graduate students in engineering, and for practicing professionals. Two introductory chapters are followed by 12 on the unit processes, e.g., diffusion, ion implantation, optical lithography, etching, epitaxial growth. The book culminates in six chapters devoted to process integration--putting everything together: "Device Isolation," "Contacts and Metallization," "CMOS Technologies," "GaAs FET Technologies," "Silicon Bipolar Technologies," and "Integrated Circuit Manufacturing." The material is somewhat self-contained, with specially marked sections for reviewing required physics, chemistry, and electronic circuits. There are problems and references at the end of each chapter. The mathematics is at an undergraduate junior level (differential equations), and the SUPREM III simulation program developed at Stanford University is featured. The appendix lists acronyms to make it easier to read material out of order. Any one chapter could be expanded into a book by itself. An impressive piece of work! G. Weiss emeritus, Polytechnic University

Choice
Copyright American Library Association, used with permission.

Campbell overviews the entire field of microfabrication for undergraduate seniors and first-year graduate students in engineering, and for practicing professionals. Two introductory chapters are followed by 12 on the unit processes, e.g., diffusion, ion implantation, optical lithography, etching, epitaxial growth. The book culminates in six chapters devoted to process integration--putting everything together: "Device Isolation," "Contacts and Metallization," "CMOS Technologies," "GaAs FET Technologies," "Silicon Bipolar Technologies," and "Integrated Circuit Manufacturing." The material is somewhat self-contained, with specially marked sections for reviewing required physics, chemistry, and electronic circuits. There are problems and references at the end of each chapter. The mathematics is at an undergraduate junior level (differential equations), and the SUPREM III simulation program developed at Stanford University is featured. The appendix lists acronyms to make it easier to read material out of order. Any one chapter could be expanded into a book by itself. An impressive piece of work! G. Weiss emeritus, Polytechnic University




Summary

The Science and Engineering of Microelectronic Fabricationprovides an introduction to microelectronic processing. Geared towards a wide audience, it may be used as a textbook for both first year graduate and upper level undergraduate courses and as a handy reference for professionals. The text covers all the basic unit processes used to fabricate integrated circuits including photolithography, plasma and reactive ion etching, ion implantation, diffusion, oxidation, evaporation, vapor phase epitaxial growth, sputtering and chemical vapor deposition. Advanced processing topics such as rapid thermal processing, nonoptical lithography, molecular beam epitaxy, and metal organic chemical vapor deposition are also presented. The physics and chemistry of each process is introduced along with descriptions of the equipment used for the manufacturing of integrated circuits. The text also discusses the integration of these processes into common technologies such as CMOS, double poly bipolar, and GaAs MESFETs. Complexity/performance tradeoffs are evaluated along with a description of the current state-of-the-art devices. Each chapter includes sample problems with solutions. The book also makes use of the process simulation package SUPREM to demonstrate impurity profiles of practical interest.